i have noticed that microsoft has laquered the 1.6b mother board covering the holes for a soderless mod chip. i have bin reading and some people say to use an exato knife to scrape off the laquer. other people say to use a pin, screwdriver, soldering iron to melt the laquer. what i am asking is what have bin the best methods people have found to open the holes on the motherboard.
Hi zbird, I modded my brother in laws 1.6 and the holes were also laquered in. I've got me a nice magnifying glass with a light and a tiny sewing and gently poked the holes with no problems. You want to be careful not to damage a trace by scratching to board with the needle, especially if you miss the hole. Take your time and things should come out ok.....Later
