Instead of trying the heatgun method I think i would rather use a butane torch, it should have plenty of heat to melt the solder and be a lot more concentrated than a heatgun, just wondering if anyone has any tips for using them? I guess i don't want the flame anywhere near touching the board. I was thinking of mounting the board on some blocks and getting on the floor underneath it and blasting it from underneath on the GPU, H/ANA and RAM chips. I have three failed xboxs here, two that have had their xclamps removed but have rrod'd again. I should also say that getting an MS repair is out of the question, and getting them fixed on a reflow is also out of the question.