Small question about thermal paste

Man, me and these questions... Well, the thing is when you apply AS5 to a processor, are you supposed to spread it out? I see people that do, and people that just smoosh their HSF right on top. But, then when they do that, I dont think the thermal paste evens out over 100% of the cpu.

Which way is best?

 

If you have a CPU with a large heat-spreader like an Athlon64 or Core 2 Duo, put a small blob on it, slap the heatsink on and let heat do the rest.
If you have a CPU with a small heat-spreader like an Athlon XP, smooth it out to a thin layer yourself before attaching the heatsink.

 

how about the apogee on a q6600?

 

The q6600 is a large die CPU isn't it? The single dot method should work.

 

also, the water cooling kit comes with AS5 ceremique (not sure how to spell it). I got some regular AS5 to go with it and I am not sure which one to use.

What do you think?

 

Either are good I'm told. You can't go wrong with Arctic silver V though.

 

Isnt the ceramique like a glue? I think I read that in the manuel for the swiftech, and how you can use it to hold heatsinks onto the vram on a graphics card, which is what I hope to do.

 

Couldn't say, I've never used it.

 

i have always put a little and then spread it around with my finger behind cling film.

 

I always use something like plastic card. An old bank / phone card is good to apply an even, smooth layer.

There is not a great difference between Silver V and Ceramique, the major differences are that ceramique has no metal / conductive materials of any kind within it, which means it doesn't conduct electrivity at all, and it isn't capacative at all! This makes is good for things like RAM , GPU's etc as it doesnt matter if you get a little on contacts of I.C's or pins.

The other difference is that people say that Ceramique is better than AS3, however I am not sure of how it compares Vs. ASV.